The MT-type of Inter-Connector, used for
testing IC-devices in packages like BGA, QFP, SOP, Flip-Chip or Bumped Wafers, consists of parallel rows of gold-plated brass wires in a silicone rubber sheet.
Wires are positioned under an angle of 60° to ease compression and improve durability. The wire angle of 60° requires contacts to use an offset of half the thickness of the silicone rubber sheet. Randomly positioning the Inter-Connector between contact pads and providing compresssion wil realize a stable, low resistance connection.
The MT-type is one of the derivatives of the GB-type and the base of several versions of MT-types dedicated to specialized fields of device testing.
Outline Dimensions:
 |
 |
|
MT-type
|
Application
|
Dimensions and Tolerances:
|
|
|
Unit
|
MT-type | MT-4X-type |
|
Pitch
|
P
|
mm
|
0.10 ± 0.03 | 0.05 ± 0.03 |
|
Pitch
|
Ps
|
mm
|
0.10 ± 0.05 | 0.05 ± 0.03 |
|
Length
|
L
|
mm
|
5.0 ± 0.5 ~ 50.0 ± 1.0
|
|
|
Width
|
W
|
mm
|
5.0 ± 0.5 ~ 50.0 ± 1.0
|
|
|
Thickness
|
T
|
mm
|
0.5, 1.0, 2.0 +0.05/-0.0 |
|
|
Filament diameter
|
|
μm
|
40 | 30 |
Sizes larger then 50L x 50W available on request.
Basic Properties:
|
|
|
Unit
|
|
|
Contact resistance *
|
|
Ω
|
< 0.1
|
|
Current carrying capacity **
|
|
mA/wire
|
50
|
|
Dielectric breakdown voltage
|
Isolator
|
V/m
|
23•106 ~ 27•106
|
|
Isolation resistance (500V DC) *
|
Ω
|
> 1.0•109
|
|
|
Operating temperature range
|
|
°C
|
-35 ~ 100
|
* Tests carried out with Shin-Etsu standard methods.
** Average when using multiple wires per electric connection.
Durability and Compression Curves:
 |
 |
| Resistance change over compression cycles Sample size: 0.5T, offsett 0.25 mm electrode 1: 0.4 mm x 0.4 mm wide Au-plated Cu-track compressed with 0.5 mm pin by 0.3 mm |
Wire offset due to wire angle of 60° (T / 2)
|
 |
|
| Resistance change over compression load Sample size: 0.5T ( offsett 0.25 mm), 1.0T (offset 0.5 mm), 2.0T (offset 1.0 mm) electrode 1: 0.4 mm x 0.4 mm wide Au-plated Cu-track, 50 patterns in series. compressed with 0.5 mm pin by 0.3 mm resistance measured by 4 wire system |
|
Attention points:
* The MT-type is generally used with a fixation and alignment frame that is not include by the MT-type.
* A small amount of silicone will remain on the substrates connected by the MT-type of Inter-Connector.
* When devices with solder bumps are pressed onto the MT-type, solder residue may adhesere to the metal filaments of the Inter-Connector.
* Contamination like dirst and dust will remarkably increase the contact resistance of the Inter-Connector.
Note:
Shin-Etsu Inter-Connector has been registered in the European Community, TM No. 000299016, and in the United States of America, TM No. 2078941.
Every item or numerical value indicated herein is measured by Shin-Etsu and out of guarantee.
Compression curves are for reference only. Actual resistances and compression forces are up to the design of substrates and holder constructions. More information can be found in the design guides.
The quality of the assembled Inter-Connector is out of guarantee.
Please make sure to review the purpose and conditions of use and practice you own tests.
Industrial ownership like patent doesn't guarantee the usage of the Inter-Connector.
