The MAF-type of Inter-Connector, developed for 
small height connections and testing substrates of PCB's or FPC's and electronic components, is a sheet of silicone rubber with brass fibers dispersed in the Z-axis. The protruded surfaces of the brass fibers are gold plated.
Custom designs are generated by punching out required shapes from standardized sheet sizes.
Outline Dimensions:
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MAF-type
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Application
FPC-FPC connection |
Application
Alternative for spring-pin |
Dimensions and Tolerances:
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Unit
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Sheet thickness
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T
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mm
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0.1, 0.2, 0.3, 0.4, 0.5 ± 0.05 |
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Length *
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L
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mm
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1.0 ~ 300.0
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Width *
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W
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mm
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1.0 ~ 50.0
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Conductive fiber diameter
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μm
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30
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Adhesive on one side available on request.
Basic Properties:
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Unit
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Shore hardness A
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ISO7619A
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65 ~ 73
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Compression set *
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%
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30 ~ 35
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Contact resistance to Au-plated substrates *
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Ω/mm2
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≤0.1
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Dielectric breakdown voltage
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V/m
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23•106 ~ 27•106
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Isolation resistance (500V DC) *
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Ω |
> 1.0•109
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Operating temperature range
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°C
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-25 ~ 85
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* Tests carried out with Shin-Etsu standard methods.
Compression Curves:
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samples sizes: |
samples size: 0.2T MAF-type sheet 0.15 mm2 Au-plated Cu electrode samples size: 0.4T MAF-type sheet 0.4 mm2 Au-plated Cu electrode |
Note:
Shin-Etsu Inter-Connector has been registered in the European Community, TM No. 000299016, and in the United States of America, TM No. 2078941.
Every item or numerical value indicated herein is measured by Shin-Etsu and out of guarantee.
Compression curves are for reference only. Actual resistances and compression forces are up to the design of substrates and holder constructions. More information can be found in the design guides.
The quality of the assembled Inter-Connector is out of guarantee.
Please make sure to review the purpose and conditions of use and practice you own tests.
Industrial ownership like patent doesn't guarantee the usage of the Inter-Connector.
