The JS-type of Inter-Connector, used for LCD's that
require lower resistance or fine pitches, is a polyester film substrate with printed silver tracks. The Inter-Connector has to be heatsealed to the LCD and PCB with the applied anisotropic adhesive that covers the silver tracks at the bonding area. JS-type of Inter-Connectors are designed to custom requirements and need custom tooling.
JSLA-type is highly used in automotive LCD modules and fully meets automotive quality requirements.
Special bonding equipment is required. Two system are in use at customer, based on constant heaters and pulse heaters. Assistance can be given to select equipment suppliers.
Outline Dimensions:
 |
 |
 |
|
JS-types
|
Application
|
Bonding equipment
|
Dimensions and Tolerances:
|
|
|
Unit
|
|
|
Pitch
|
P
|
mm
|
0.19 ≤ P < 0.4 ± 0.03 0.4 ≤ P < 1.0 ± 0.05 P ≥ 1.0 ± 0.10 |
| Accumulative pitch | TP, P≤0.4 TP, P>0.4 |
mm | ± 0.05 ± 0.10 |
|
Length *
|
L
|
mm
|
≤ 100 ± 0.25
|
|
Height *
|
H
|
mm
|
10.0 ~ 120.0 ± 0.25
120.1 ~ 150.0 ± 0.5 |
|
Width conductive track
|
Tc
|
mm
|
≥ 0.10
|
|
Thickness of base film
|
|
μm
|
25
|
| Thickness of cover film (optional) | Tc |
μm
|
12 25 |
* Maximum sizes depend on the pitch of the tracks.
Construction:
| JS-KN-type | JS-LA-type | |
|
Base film
|
polyester | |
|
Conductive lines
|
thermosetting resin silver/carbon ink | |
|
Adhesive
|
semi-thermosetting synthetic rubber | thermosetting synthetic rubber |
|
Conductive particles
|
gold-plated carbon particles | gold-plated plastic particles |
| Isolation layer | printed thermoplastic synthetic rubber | printed UV setting resin |
Basic properties:
|
|
Unit
|
JS-KN-type
|
JS-LA-type
|
Conditions |
|
Surface resistance
|
Ω/sq
|
< 0.5
|
10 ~ 30 °C, 30 ~ 80% RH | |
|
Isolation resitance
|
Ω
|
≥ 1.0•108
|
10 ~ 30 °C, 30 ~ 80% RH | |
|
Peel strength
|
N/cm
|
≥ 2.94
|
≥ 4.9
|
90° peel, 100 mm/min. |
|
Storage time
|
months
|
< 6 | sealed in original package, dark, 0 ~ 40 °C | |
|
Operating temperature range
|
°C
|
-40 ~ 85
|
-40 ~ 110
|
|
* Tests carried out with Shin-Etsu standard methods.
Bonding condictions:
|
|
Unit
|
JS-KN-type
|
JS-LA-type
|
Conditions |
|
Adhesive temperature
|
°C
|
140 ~ 170
|
160 ~ 190
|
applied to bonding area only |
|
Pressure
|
MPa
|
3.5 ± 0.5
|
4.0 ± 0.5
|
|
|
Time
|
s
|
7 ± 2
|
6 ± 2
|
adhesive temperature ≥ 140/160 °C |
Note:
Shin-Etsu Inter-Connector has been registered in the European Community, TM No. 000299016, and in the United States of America, TM No. 2078941.
Every item or numerical value indicated herein is measured by Shin-Etsu and out of guarantee.
Data in tables is for reference only. Actual resistances and forces are up to the design of the assembly. More information can be found in the design guides.
The quality of the assembled Inter-Connector is out of guarantee.
Please make sure to review the purpose and conditions of use and practice you own tests.
Industrial ownership like patent doesn't guarantee the usage of the Inter-Connector.
